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Doosan Corporation - Electro-Materials

FCCL

As a 2L FCCL that has excellent flexural and sliding characteristics at the small radius of curvature(0.65mm) used in cellular phones, HDD pick-ups multi-layer FPC, rigid flex, etc.

Single Layer

Features

  • Excellent folding endurance
  • Excellent flexural endurance
  • Good dimensional stability
  • Good bonding strength to bonding sheet/prepreg

Features

Applications

  • PGBA, BoC, FCBGA, FCCSP etc.

Special product for slim slide phone

  • High flexural endurance - bends radius(R = 0.65 mm)
    (Super flex RA cu has a best flexural endurance characteristics in case of low radius)

RA vs. ED Slide Test(with Shield film)

RA vs. ED Slide Test(with Shield film)

Sliding Test Method

Sliding Test Method

Sample Structure

Sample Structure
Properties
Unit DSflex -600 Test method
091200R
(HA)		121200R
(HA)		121200E
(EDI)
Peel Strength Kgf/cm 0.9 1.0 1.2 IPC-TM-650 2.4.9
Dimensional Stability
After etching (MD/TD)
After thermal (MD/TD)		 % Max ± 0.1
Max ± 0.1		 Max ± 0.1
Max ± 0.1		 Max ± 0.1
Max ± 0.1		 IPC-TM-650 2.2.4
Flexural
Endurance		 MIT (R=0.38) times 14,000 10,000 5,000 With C/L (HGCK-A305L)
Slide(R=0.65) cycles >300,000 260,000 30,000 With C/L (HGCK-A305L)
With Shield (PC-5000)
Young`s Modulus Gpa 5.2 5.2 5.2 IPC-TM-650 2.4.19
Tensile strength Mpa 210 210 210
Elongation % 35 35 35

Rule of product code for 2L FCCL

Rule of product code for 2L FCCL

Definition

Adhesive-less 2 layer flexible copper clad can be used in fabrication of flexible printed circuits, offered in roll from with copper on one or both sides. Dsflex-600 is suitable for a wide variety of flexible circuit applications which need high performance, thermal resistance, fine pitch and high reliability.

Double Layer

Features

  • Excellent folding endurance
  • Excellent flexural endurance
  • Good dimensional stability

Features

Applications

  • PGBA, BoC, FCBGA, FCCSP etc.

Special product for slim slide phone

  • High Flexural Endurance - Bends Radius(R = 0.65 mm)
    (Super flex RA cu has a best flexural endurance characteristics in case of low radius)

RA vs. ED Slide Test(with Shield film)

RA vs. ED Slide Test(with Shield film)

Sliding Test Method

Sliding Test Method

Sample Structure

Sample Structure
Properties
Unit DSflex -600
 Test method
121212R
(RSH)		121212E
(EDI)
Peel Strength Kgf/cm 1.1 1.2 IPC-TM-650 2.4.9
Dimensional Stability
After etching (MD/TD)
After thermal (MD/TD)		 % Max ± 0.1
Max ± 0.1		 Max ± 0.1
Max ± 0.1		 IPC-TM-650 2.2.4
Flexural
Endurance		 MIT (R=0.38) times 7,000 6,000 With C/L (HGCK-A305L)
Slide(R=0.65) cycles 120,000 20,000 With C/L (HGCK-A305L)
With Shield (PC-5000)
Young`s Modulus Gpa 5.3 5.3 IPC-TM-650 2.4.19
Tensile strength Mpa 187 187
Elongation % 55 55

Rule of product code for 2L FCCL

Rule of product code for 2L FCCL

Definition

Adhesive-less 2 layer flexible copper clad can be used in fabrication of flexible printed circuits, offered in roll from with copper on one or both sides. Dsflex-600 is suitable for a wide variety of flexible circuit applications which need high performance, thermal resistance, fine pitch and high reliability.

Bonding Prepreg

An FPCB laminate material used as an adhesive and insulating layer for glass fiber types and which does not generate impurities during the work process. Its application includes cellular phones, HDD pick-ups multi-layer FPC, rigid flex, etc.

DS-7408 BS(DF) / DS-7409 BS(DF) / DS-7402 BS(DF)

Features

  • DS-7408 BS(DF)
    -Very low dust in punching and cutting process
    -Good adhesion strength
  • DS-7409 BS(DF)
    -High Tg
    -Excellent thermal resistance (>300 sec @288℃)
    -Low CTE in Z-axis
  • DS-7402 BS(DF)
    -Halogen-free and middle Tg
    -Very low dust in punching and cutting process
    -Low CTE in Z-axis
G/F Resin Content Thickness(㎛)
after press
1015 53~66% 20 ± 2
1035 50 ± 3
1037 40 ± 3
1067 60 ± 3
1078 80 ± 3
3313 100 ± 5

General Specification

General Properties

Test Item Unit Test Method DS-7408 BS(DF) DS-7409 BS(DF) DS-7402
BS(DF)
Resin Flow mm IPC TM-650 2.3.17.2 less than 2.omm
Tg ℃ DSC above 130 above 170 above 150
TMA above 120 above 160 above 140
Flammability - UL94 V-0 V-0 V-0
Solder Float(288℃) sec A above 120 above 300 above 300
Peel Strength(1 oz Cu) kgf/cm A above 1.4 above 1.4 above 1.4
Peel Strength(Pl Base) kgf/cm A above 1.2 above 1.0 above 1.0
Dielectric Constanr(1GHz) - IPC TM-650 2.5.5.3 3.79 3.92 3.72
Dissipation Factor(1GHz) - IPC TM-650 2.5.5.3 0.016 0.016 0.016
Water Absorption % E-24/50+D24/23 less than 0.20

Preperg Parameter

  • DS-7408 BS(DF)

G/F RC Thickness(㎛)
1015 53% 25 ± 3
1027 54% 30 ± 3
1035 57%, 61% 40, 50 ± 3
1037 61% 45 ± 3
1067 66% 65 ± 3
1078 66%, 61% 85 ± 3
3313 52%, 56% 110~130 ± 5
2166 48% 120 ± 5

  • DS-7409 BS(DF)

G/F RC Thickness(㎛)
1027 54%~60% 25 ± 3
1035 61% 45 ± 3
1037 61% 40, 50 ± 3
1067 66% 65 ± 3
1078 52%, 54% 75 ± 3
1080 65% 80 ± 3
3313 52% 110 ± 5
2166 53% 150 ± 5

  • DS-7402 BS(DF)

G/F RC Thickness(㎛)
1035 62%, 65% 45 ± 3
1037 58%~65% 45 ± 3
1067 66%, 68% 60 ± 3
1078 62%, 65% 85 ± 3
3313 55%, 58% 110 ± 5
2166 50%, 52% 120 ± 5

Recommended Press Cycle

Recommended Press Cycle

Stiffener

A reinforcing sheet that facilitates parts mounting on FPCB.

DS-7405(ST) / DS-7402(ST), DS-7209(ST)

Features

  • Flammability(UL 94 V-0)
  • Good thermal resistance
  • Good punching property

General Properties

Test Item Unit Test Method DS-7405(ST) DS-7402(ST) DS-7209(ST)
Tg ℃ DSC 135 130 130
CTE Z-axis ppm/℃ TMA 60 60 55
Surface Resistance ohm IPC TM-650 2.5.17 1E13 1E13 1E13
Volume Resisrance ohm-cm IPC TM-650 2.5.17 1E15 1E15 1E15
Flammability - UL 94 V-0 V-0 V-0

Purchasing Information

  • DS-7405(ST), DS-7402(ST) : 0.1~2.0mm available
  • DS-7209(ST) : 0.2~0.4mm(Low dust in drilling and punching)
    - recommended for COF and FPCB
Standard Size Tolerance(mm)
1,020 x 1,220mm(40° x 48°) 0~+3
1,020 x 1,020mm(40° x 40°)
1,070 x 1,220mm(42° x 48°)