- Copper Clad Laminate
- Material for Package Substrates
- Material for Flexible PCB
- Heat Dissipation Materials
- Masslam
- OLED
- Application
- ROHS Compliant
- IPC Specification Number
- A to Z Index
The lead free substrate material for IC package has enhanced moisture absorbability and heat resistance properties and reliability.
- DS-7409H
- DS-7409HF
A highly reliable and environment-friendly substrate material for the IC package. It has a low CTE and high elastic modulus and meets the trend for thinner, denser circuitry.
- DS-7409HG / DS-7409HG B
-
Features
- Halogen & phosphorus free
- Low thermal expansion
- High elastic modulus
- Superior heat resistance
- UV blocking & AOI compatible
Applications
- PGBA, BoC, FCBGA, FCCSP etc.
General Properties
Test Item Unit Test Method Treatment Condition Typical Value Peel strength(Cu foil 1oz) kgf/cm IPC-TM-650 2.4.8 A 0.8 CTE X-axis ppm℃ IPC-TM-650 2.4.24.5 ambient to Tg 13 Y-axis 13 Z-axis 25 Tg ℃ IPC-TM-650 2.4.24.3
IPC-TM-650 2.4.24cDMA
TMA240
200Decomposition Temperature ℃ IPC-TM-650 2.4.24.6 5% loss, TGA 430 T-288 min IPC-TM-650 2.4.24.1 TMA over 100 Dielectric Constanr(1GHz) - IPC-TM-650 2.5.5.9 1GHz, A condirion 4.6 Dissipation Factor(1GHz) - IPC-TM-650 2.5.5.9 C-96/20/65
C-96/20/65 + D-48/500.007~0.012
0.010~0.015Young’s Mpdulus GPa A 32
Paper Parameter
[Thin Core] DS-7408(LT)
Thickness(mm) Lass Fabric Coper Foil spec. 0.04 1015 x 2/1037 x 1 T/T, H/H,1/1 0.05 1027 x 2/1035 x 1 0.06 1037 x 2/1035 x 2
/1015 x 30.10 1078 x 2/2116 x 1 0.15 1078 x 3/1501x2 0.20 1078 x 4/2116 x 2 0.40 7628 x 3 0.80 7628 x 4
- 0:No copper, T:1/3 oz, H:0.5 oz, 1:1 oz, 2:2oz
1/1:1oz copper foil on one side/1 oz on the other side - Thickness data are typical values.
Each value has variation of about ±(0.1~0.2)mm.
[Bonding Sheet] DS-7408(LT)
Glass Fabric Resin Content Thickness(mm) 1037 74% 0.04 2116 58% 0.10
- Data of Resin and Thickness are typical values.
Each value has variation of about ±3%, 0.05mm.
Recommended Press Cycle
- SAF-PT
- SAF-AT
