Masslam producing semi-finished products has a wide range of PCB. A range of Masslam product is LCD(consumer products), mobile devices(HHP), memory chips.
- Masslam
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Features
- High Quality Excellent appearance, Fine registration
- Various usage ICM, Build-up, Substrate, Network
- Wide solution Impedance control, Fine Pattern, Hi-Tg laminate, Green(Halogen free) laminate
Applications
- Build-up PCB for Mobile phones
- Impedance Control Board
- LCD Board
- IC Module
- Network, Automobile Devices
- BGA Substrat
Customer
- Samsung Electro-Mechanics
- Daeduck Electronics
- CMK (Japan, China)
- Isuexaboard
- Simmteck
- LG innoteck
- DAP
- Korea Circuit
- Cosmotech
Capacity & Delivery
- Capacity : 70,000㎡/month
- Delivery : 3~5 days(Depend on Specifications)
Manufacturing Capability of Masslam
Item Normal Prototype To-Be General Layers counts(conventional PCB) 4~12 L 2~24 L 2~24 L Max. Working Size(mm) 620 x 520 625 x 535 depend on customer design Min. Working Dize(mm) 344 x 411 250 x 300 Copper Foil(innerlayer) 1/3 ~ 2 oz 1/3 ~ 2 oz 1/3 ~ 4 oz Min. Core Thickness 80㎛ 1/1 60㎛ 1/1 50㎛ H/H Board thickness(mm) 0.4 ~ 2.0 0.3 ~ 2.4 0.3 ~ 2.4 Inner Layer Min. Line Width/Space 1/1 oz 75 / 75 ㎛ 75 / 75 ㎛ 50 / 50 ㎛ Min. Line Width/Space H/H oz 50 / 50 ㎛ 50 / 50 ㎛ 40 / 40 ㎛ Lamination Thickness Tolerance ±10% ±7% ±5% Dielectric Thickness Tolerance ±10% ±7% ±5% Layer to Layer Registration <= 50 ㎛ <= 25 ㎛ <= 10 ㎛ Core to Core Registration <= 75 ㎛ <= 75 ㎛ <= 50 ㎛ Tooling Hole Pitch ± 100 ㎛ ± 75 ㎛ ± 50 ㎛ Outline Dimension Tolerance ± 1.0 mm ± 0.5 mm ± 0.5 mm Warpage Tolerance 0.70% 0.70% 0.70%
Facility of Doosan Masslam
Facility SET Chemical Rinse 
4 D/F Laminator 
4 Parallet Light Exposure 
8 DES 
3 Automatic Optical Inspection 
10 Horizontal Brown Oxide 
2 Half Size Press (15 Layers) 
4 Quarter Size Press (10 Layers) 3 X-Ray & Trimming 
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