As the application of electronic devises extends to the base substrate for LEDE and high voltage PCB, PCB materials are required to provide heat dissipation and heat resistance properties. This material includes the MCCL used as the LCD backlight of the LED light source and LED lighting, metal base CLL, and the HCCL using a copper clad of 6 oz or above.
Metal base CCL for fast heat transfer and dissipation.
- DST-5000 / DSTF-5000
-
Features
- High heat dissipation
- Excellent thermal durability
- Good circuit workability
Application (DST-5000)
- LED, PDP, Regulator for TV
- LED light
- Inverter & Converter
- Igniter, Voltage regulator
- Rectifier, Power supply
Application (DSTF-5000)
- LED, 3D LED, Regulator for TV
- Module
- Personal computer, notebook computer
- Cellular phone, A/V device, etc.
Sample Structure
- DST-5000
- DSTF-5000
General Properties
Test Item Unit Test Method DST-5000 DSTF-5000 Flammability - UL 94 V-0 V-0 Solder Float(288℃) min A above 10 above 10 Solder Float(260℃) min A above 30 above 30 Peel Strength(1 oz Cu) kgf/cm A above 1.5 above 1.5 Thermal Conductivity W/mK A 2.0 2.0 Dielectric Breakdown Voltage AC kV A above 3 above 3 Comparative Tracking Index volt IEC Method 600 600 Dielectric Constant - 1MHz 6.0 6.0 - 1GHz 5.6 5.6 Dissipation Factor - 1Mhz 0.014 0.014 - 1GHz 0.016 0.016 DST-5000 : Specimen thickness Al 1.5mm, Insulation layer 95㎛, Cu 35㎛(1 oz)DSTF-5000 : Specimen thickness: Insulation layer 100um, Cu 18um (1/2 oz)
Application of car electronic devices is increasing rapidly. HCCL products are necessary for the successful application of car electronics including a stable power supply and effective heat dissipation.
- DS-7106(HC) / DS-7209(HC), DS-7408(HC), DS-7409(HC)
-
History of Automotive Applications
1950 Direct Wire : Wires & Crimped Terminals
Strength - Least Expensive of all methods Weaknesses - Least reliable
- Many quality problems in manufacturing and assembly
- Massive safety recalls can happen
- Characterized by intermittent open
- Modern vehicles can nor tolerate large area required to implement
1980 Metal Fret : Stamped Metal Pieces
Strength - Low cost in high volumes
- Able to manage higher density circuitsWeaknesses - Lower reliability than PCB
- Very expensive to change design
- Very long time to make first parts from tools
- Complex mold and stamping tools are required
- Assembly is labor intensive
- Expensive to use for more than three vehicle option levels
- Very heavy
1995 PCB : Circuit board & Bus-bars
Strength - Low cost
- High density of circuits
- Integration of electronicsWeaknesses - Sensitive to thermal shock
2003 Doosan HCCL 100㎛~400㎛ Copper
Strength - Cost competitive with metal fret
- High density of heat sink
- Excellent as heat sink
- Lighter than Metal fret
- Integration of electronics
- Operates much cooler
- Fast turnaround time when design changes occur
- Highest reliability
- Possible to predict thernal distribution
- Best used when current demands are high
- Insensitive to thermal shock
- Small dimensional changes in copper traces result in negligible heat changesWeaknesses - Requires higher level of automation in manufacturing
General Properties
Test
ItemUnit Treatment Condition DS-7106
(HC)
(CEM-1)DS-7209
(HC)
(CEM-3)DS-7406
(HC)
(FR-4)DS-7409
(HC)
(FR-4)Tg ℃ TMA
DSC
DMA65
-
-130
-
-140
140
165165
170
180CTE X-axis
Y-axis
Z-axisppm
/℃ambient to Tg 24
20
-22
20
5518
15
5916
15
50Dielectric Constant
(1MHz)- C-96/20/65
C-96/20/65 + D-48/504.0~4.5
4.2~4.84.2~4.5
4.3~4.84.5~4.8
4.6~5.24.5~4.8
4.6~5.2Dissipation Factor
(1MHz)- C-96/20/65
C-96/20/65 + D-48/500.015~
0.023
0.018~
0.0230.015~
0.020
0.018~
0.0230.015~
0.028
0.018~
0.0230.015~
0.020
0.018~
0.023Solder Float sec A >240
(260℃)>240
(275℃)>240
(275℃)>240
(275℃)Peel strength Num A
260℃ / 10sec6.5~11
6.0~106.5~11
6.0~106.5~11
6.0~106.5~11
6.0~10Water Absorption % E-24/50 + D-24/23 0.30~0.35 0.10~0.15 0.10~0.15 0.10~0.15
Standard Size Tolerance(mm) 1,020 x 1,220mm(40° x 48°) 915 x 1,220mm(36° x 48°) +3 1,070 x 1,220mm(42° x 48°) 970 x 1,020mm(38° x 48°) -0 1,020 x 1,020mm(40° x 40°)
