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Doosan Corporation - Electro-Materials

FR-4(Glass Epoxy Laminate)

The Glass Epoxy Laminates, which have been used widely in industrial equipment, have been further refined and are helping to promote sustainable economic growth in an environmentally friendly way according to changes in our life styles and are the basis on which environment-friendly products, including mobile applications, computer systems, and car electronics have been developed and produced.

DS-7402

Features

  • Middle Tg(Tg 150℃)
  • Halogen-free, antimony-free, and red phosphorus-free
  • high decomposition temperature
  • Low z-axis CTE
  • Anti-CAF property

Applications

  • Alternative for conventional lead-free FR-4
  • Personal computer, notebook computer
  • Cellular phone, A/V device, etc.

General Properties

  • CAF resistance test result

CAF resistance test result
  • Lead-free soldering test result

Lead-free soldering test result
PropertyUnitTest ConditionTypical ValueTest Method
Tg ℃ DSC 150 IPC-TM-650.2.4.25c
    TMA 150 IPC-TM-650.2.4.24c
CTE Z-axis ppm/℃ Ambient to Tg 45 IPC-TM-650.2.4.41
Z-axis expansion % 50℃ to 260℃ 3.0 IPC-TM-650.2.4.41
Decomposition temperature(5% wt loss) ℃ TGA 370 IPC-TM-650.2.4.40
T-260 min TMA 120 IPC-TM-650.2.4.24.1
T-288 min TMA >60 IPC-TM-650.2.4.24.1
Dielectric constant(Resin content 50%)   C-24/23/50(1GHz) 4.4 IPC-TM-650.2.5.5.9
Dissipation factor(Resin content 50%)   C-24/23/50(1GHz) 0.014 IPC-TM-650.2.5.5.9
Peel strength(Standard profile 1oz) N/mm Condition A 1.6 IPC-TM-650.2.4.8
Water absorption % E-24/50+D-24/23 0.13 IPC-TM-650.2.6.2.1
*IPC-4101B/92
*Test specimen thickness: 1.0mm(7628x5)

DS-7402H

Features

  • Halogen-free, antimony-free, and red phosphorus-free
  • Excellent thermal performance
  • High Tg(above 170℃)
  • Low z-axis CTE
  • Good reliability at harsh environment

Applications

  • High layer count boards
  • Computer, instrumentation, automotives and network servers

General Properties

  • Interconnection stress test result

Interconnection stress test result
  • Lead-free soldering test result

Lead-free soldering test result
PropertyUnitTest ConditionTypical ValueTest Method
Tg ℃ DSC 170 IPC-TM-650.2.4.25c
    TMA 170 IPC-TM-650.2.4.24c
CTE Z-axis ppm/℃ Ambient to Tg 40 IPC-TM-650.2.4.41
Z-axis expansion % 50℃ to 260℃ 2.8 IPC-TM-650.2.4.41
Decomposition temperature(5% wt loss) ℃ TGA 380 IPC-TM-650.2.4.40
T-260 min TMA 120 IPC-TM-650.2.4.24.1
T-288 min TMA 15 IPC-TM-650.2.4.24.1
Dielectric constant(Resin content 50%)   C-24/23/50(1GHz) 4.4 IPC-TM-650.2.5.5.9
Dissipation factor(Resin content 50%)   C-24/23/50(1GHz) 0.014 IPC-TM-650.2.5.5.9
Peel strength(Standard profile 1oz) N/mm Condition A 1.7 IPC-TM-650.2.4.8
Water absorption % E-24/50+D-24/23 0.12 IPC-TM-650.2.6.2.1
*IPC-4101B/94
*Test specimen thickness: 1.0mm(7628x5)

DS-7409

Features

  • High Tg glass transition temperature
  • Lower permittivity(Dk) than conventional FR-4
  • Good adhesion of copper foil and inner layers

Applications

  • High-layer count backplanes
  • High density interconnects
  • Suitable for fine line multi-layers

General Properties

PropertyUnitTest ConditionTypical ValueTest Method
Tg ℃ DSC 170 IPC-TM-650.2.4.25c
    TMA 165 IPC-TM-650.2.4.24c
CTE Z-axis ppm/℃ Ambient to Tg 41 IPC-TM-650.2.4.41
Z-axis expansion % 50℃ to 260℃ 3.3 IPC-TM-650.2.4.41
Decomposition temperature(5% wt loss) ℃ TGA 295 IPC-TM-650.2.4.40
T-260 min TMA 7 IPC-TM-650.2.4.24.1
T-288 min TMA - IPC-TM-650.2.4.24.1
Dielectric constant(Resin content 50%)   C-24/23/50(1GHz) 4.2 IPC-TM-650.2.5.5.9
Dissipation factor(Resin content 50%)   C-24/23/50(1GHz) 0.015 IPC-TM-650.2.5.5.9
Peel strength(Standard profile 1oz) N/mm Condition A 2.0 IPC-TM-650.2.4.8
Water absorption % E-24/50+D-24/23 0.12 IPC-TM-650.2.6.2.1
*IPC-4101B/21
*Test specimen thickness: 1.0mm(7628x5)

DS-7409S(N)

Features

  • High (above 170℃)
  • Excellent thermals performance
  • Good moisture resistance
  • CAF resistant
  • Suitable for lead-free soldering process

Applications

  • High-layer count boards
  • High density multi-layer boards
  • Servers, advance computers, workstation and automotives

General Properties

  • Multiple thermal excursion test result

Multiple thermal excursion test result
Test Condition(1.0T)DS-7409S)N)Standard Tg
PCT 1hr+
solder dipping 288℃/10sec		 O O O O O X
PCT 2hr+
solder dipping 288℃/10sec		 O O O O X X
PCT 3hr+
solder dipping 288℃/10sec		 O O O X X X
O : No abnormality X : measling or delamination
PropertyUnitTest ConditionTypical ValueTest Method
Tg ℃ DSC 170 IPC-TM-650.2.4.25c
    TMA 165 IPC-TM-650.2.4.24c
CTE Z-axis ppm/℃ Ambient to Tg 50 IPC-TM-650.2.4.41
Z-axis expansion % 50℃ to 260℃ 3.2 IPC-TM-650.2.4.41
Decomposition temperature(5% wt loss) ℃ TGA 350 IPC-TM-650.2.4.40
T-260 min TMA 120 IPC-TM-650.2.4.24.1
T-288 min TMA 10 IPC-TM-650.2.4.24.1
Dielectric constant(Resin content 50%)   C-24/23/50(1GHz) 4.2 IPC-TM-650.2.5.5.9
Dissipation factor(Resin content 50%)   C-24/23/50(1GHz) 0.015 IPC-TM-650.2.5.5.9
Peel strength(Standard profile 1oz) N/mm Condition A 1.7 IPC-TM-650.2.4.8
Water absorption % E-24/50+D-24/23 0.06 IPC-TM-650.2.6.2.1
*IPC-4101B/24
*Test specimen thickness: 1.0mm(7628x5)

DS-7409S(F)

Features

  • High Tg(above 170℃)
  • Excellent through hole reliability
  • Low z-axis CTE
  • High heat robustness
  • Suitable for lead-free soldering process

Applications

  • High layer count boards
  • High density multi-layer boards
  • Networks equipments, automotives and measuring instruments

General Properties

  • Multiple thermal excursion test result

Multiple thermal excursion test result
  • Interconnection stress test result

Interconnection stress test result
PropertyUnitTest ConditionTypical ValueTest Method
Tg ℃ DSC 170 IPC-TM-650.2.4.25c
    TMA 165 IPC-TM-650.2.4.24c
CTE Z-axis ppm/℃ Ambient to Tg 40 IPC-TM-650.2.4.41
Z-axis expansion % 50℃ to 260℃ 2.8 IPC-TM-650.2.4.41
Decomposition temperature(5% wt loss) ℃ TGA 350 IPC-TM-650.2.4.40
T-260 min TMA 120 IPC-TM-650.2.4.24.1
T-288 min TMA 10 IPC-TM-650.2.4.24.1
Dielectric constant(Resin content 50%)   C-24/23/50(1GHz) 4.2 IPC-TM-650.2.5.5.9
Dissipation factor(Resin content 50%)   C-24/23/50(1GHz) 0.016 IPC-TM-650.2.5.5.9
Peel strength(Standard profile 1oz) N/mm Condition A 1.7 IPC-TM-650.2.4.8
Water absorption % E-24/50+D-24/23 0.06 IPC-TM-650.2.6.2.1
*IPC-4101B/98
*Test specimen thickness: 1.0mm(7628x5)

DS-7409D

Features

  • Low dk & low df for high signal speed and signal integrity
  • Excellent through hole reliability
  • High Tg(above 170℃)
  • Compatible with standard FR-4 PCB process

Applications

  • Cellular phone base stations
  • High speed computing
  • High frequency modules
  • Networks equipments

General Properties

  • Interconnection stress test result

Interconnection stress test result
  • Interconnection stress test result

Interconnection stress test result
PropertyUnitTest ConditionTypical ValueTest Method
Tg ℃ DSC 170 IPC-TM-650.2.4.25c
    TMA 165 IPC-TM-650.2.4.24c
CTE Z-axis ppm/℃ Ambient to Tg 40 IPC-TM-650.2.4.41
Z-axis expansion % 50℃ to 260℃ 2.8 IPC-TM-650.2.4.41
Decomposition temperature(5% wt loss) ℃ TGA 350 IPC-TM-650.2.4.40
T-260 min TMA 120 IPC-TM-650.2.4.24.1
T-288 min TMA 10 IPC-TM-650.2.4.24.1
Dielectric constant(Resin content 50%)   C-24/23/50(1GHz) 4.2 IPC-TM-650.2.5.5.9
Dissipation factor(Resin content 50%)   C-24/23/50(1GHz) 0.016 IPC-TM-650.2.5.5.9
Peel strength(Standard profile 1oz) N/mm Condition A 1.7 IPC-TM-650.2.4.8
Water absorption % E-24/50+D-24/23 0.06 IPC-TM-650.2.6.2.1
*IPC-4101B/98
*Test specimen thickness: 1.0mm(7628x5)

DS-7409D(T)
DS-7409(M)

DS-7408(LT) / DS-7408(LTF)

Features

  • Middle Tg(150℃)
  • Superior moisture resistance
  • Excellent thermal performance
  • Low z-axis expansion for DS-7408(LTF)
  • Suitable for lead-free soldering process

Applications

  • High density interconnects
  • Memory modules. PCBs for LCD

General Properties

  • Thermal cycling test result for DS-7408(LT)

Thermal cycling test result for DS-7408(LT)
  • Interconnection stress test result for DS-7408(LTF)

Interconnection stress test result for DS-7408(LTF)
PropertyUnitTest
Condition		DS-7408
(LT)		DS-7408
(LTF) 		Test Method
Tg ℃ DSC 150 150 IPC-TM-650.2.4.25c
    TMA 150 150 IPC-TM-650.2.4.24c
CTE Z-axis ppm/℃ Ambient to Tg 55 45 IPC-TM-650.2.4.41
Z-axis expansion % 50℃ to 260℃ 3.5 3.2 IPC-TM-650.2.4.41
Decomposition temperature(5% wt loss) ℃ TGA 350 350 IPC-TM-650.2.4.40
T-260 min TMA 60 60 IPC-TM-650.2.4.24.1
T-288 min TMA 5 10 IPC-TM-650.2.4.24.1
Dielectric constant(Resin content 50%)   C-24/23/50(1GHz) 4.2 4.3 IPC-TM-650.2.5.5.9
Dissipation factor(Resin content 50%)   C-24/23/50(1GHz) 0.016 0.015 IPC-TM-650.2.5.5.9
Peel strength(Standard profile 1oz) N/mm Condition A 1.7 1.6 IPC-TM-650.2.4.8
Water absorption % E-24/50+D-24/23 0.08 0.08 IPC-TM-650.2.6.2.1
*IPC-4101B/21
*Test specimen thickness: 1.0mm(7628x5)

DS-7408

Features

  • Tetra-functional epoxy resin type
  • Good performance through humidity and thermal exposure
  • Good chemical resistance
  • UV blocking and AOI compatible

Applications

  • Base materials for 6-10 multi-layer application
  • Computer, VCR, instrumentation and electronic game machine

PropertyUnitTest ConditionTypical ValueTest Method
Tg ℃ DSC 140 IPC-TM-650.2.4.25c
    TMA 140 IPC-TM-650.2.4.24c
CTE Z-axis ppm/℃ Ambient to Tg 58 IPC-TM-650.2.4.41
Z-axis expansion % 50℃ to 260℃ 3.7 IPC-TM-650.2.4.41
Decomposition temperature(5% wt loss) ℃ TGA 320 IPC-TM-650.2.4.40
T-260 min TMA 15 IPC-TM-650.2.4.24.1
T-288 min TMA 2 IPC-TM-650.2.4.24.1
Dielectric constant(Resin content 50%)   C-24/23/50(1GHz) 4.3 IPC-TM-650.2.5.5.9
Dissipation factor(Resin Content 50%)   C-24/23/50(1GHz) 0.014 IPC-TM-650.2.5.5.9
Peel strength(Standard profile 1oz) N/mm Condition A 1.6 IPC-TM-650.2.4.8
Water absorption % E-24/50+D-24/23 0.10 IPC-TM-650.2.6.2.1
*IPC-4101B/21
*Test specimen thickness: 1.0mm(7628x5)

DS-7405 / DS-7405(UV) / DS-7405S

Features

  • Di-functional epoxy resin type
  • Good dimensional stability
  • Good electric properties
  • UV blocking property for DS-7405(UV)
  • High CTI property for DS-7405S

Applications

  • Computer & peripherals
  • VCR, TV, electronic game machine, etc.

General Properties

PropertyUnitTest ConditionDS-7405DS-7405
(UV)		DS-
7405S
Tg ℃ DSC 135 135 135
    TMA 135 135 135
CTE Z-axis ppm/℃ Ambient to Tg 60 60 60
Z-axis expansion % 50℃ to 260℃ 3.8 3.8 3.8
Decomposition temperature(5% wt loss) ℃ TGA 315 315 315
T-260 min TMA 15 15 15
T-288 min TMA 2 2 2
Dielectric constant(Resin content 50%)   C-24/23/50(1GHz) 4.3 4.3 4.3
Dissipation factor(Resin content 50%)   C-24/23/50(1GHz) 0.014 0.014 0.014
CTI volt   150 150 150
Peel strength(Standard profile 1oz) N/mm Condition A 1.9 1.9 1.9
Water absorption % E-24/50+D-24/23 0.13 0.13 0.13
*IPC-4101B/21
*Test specimen thickness: 1.0mm(7628x5)

CEM-3

The CEM-3 product group, which has been realized by combining the superior performance of the glass epoxy laminate and also excellent workability, maximizes cost-efficiency.

DS-7209

Features

  • Process similar to FR-4 including PTH
  • Punching process applicable
  • Excellent mechanical & electrical properties
  • Lower thermal expansion

Applications

  • Test & measurement equipment, tuner, car electronics, power supply, etc.

General Properties

Test ItemUnitTest ConditionProperty Data
Standard Value
Tg ℃ DSC
TMA		 135
130
CTE x-axis
y-axis
z-axis		 ppm/℃ Ambient to Tg 28
24
55
Flammability - UL-94 V-0
Insulation Resistance ohm C-96/20/65
C-96/20/65+D-2/100		 1 x 1012 - 1 x 1013
1 x 1010 - 1 x 1011
Volume Resistivity ohm-cm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1014 - 1 x 1015
5 x 1013 - 5 x 1014
Surface Resistance ohm C-96/20/65
C-96/20/65+C-96/40/90		 5 x 1012 - 5 x 1014
1 x 1012 - 1 x 1013
Arc Resistance min. sec   110
Dielectric Constant(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 4.2 - 4.5
4.3 - 4.8
Dissipation Factor(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 0.015 - 0.020
0.018 - 0.023
Comparative Tracking Index volt ICE Method -
Solder Float(260℃) sec A above 120
Peel Strength Cu.foil 1oz(0.035mm) kg/cm A 1.6 - 1.8
Flexural Strength kgf/mm2 A 30 - 40
Water Absorption % E-24/50+D-24/23 0.10 - 0.15
Specimen Thickness : 1.6mm

DS-7209A

Features

  • High C.T.I value(above 600V)
  • Process similar to FR-4 including PTH
  • Punching process applicable

Applications

  • Test & measurement equipment, tuner, car electronics, power supply, etc.

General Properties

Test ItemUnitTest ConditionProperty Data
Standard Value
Tg ℃ DSC
TMA		 135
130
CTE x-axis
y-axis
z-axis		 ppm/℃ Ambient to Tg 20
16
55
Flammability - UL-94 V-0
Insulation Resistance ohm C-96/20/65
C-96/20/65+D-2/100		 1 x 1012 - 1 x 1013
1 x 1010 - 1 x 1011
Volume Resistivity ohm-cm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1014 - 1 x 1015
5 x 1013 - 5 x 1014
Surface Resistance ohm C-96/20/65
C-96/20/65+C-96/40/90		 5 x 1012 - 5 x 1014
1 x 1012 - 1 x 1013
Arc Resistance min. sec   110
Dielectric Constant(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 4.3 – 4.7
4.3 – 5.0
Dissipation Factor(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 0.015 – 0.020
0.018 - 0.023
Comparative Tracking Index volt ICE Method 200
Solder Float(260℃) sec A above 120
Peel Strength Cu.foil 1oz(0.035mm) kg/cm A 1.5 – 1.8
Flexural Strength kgf/mm2 A 30 – 40
Water Absorption % E-24/50+D-24/23 0.10 – 0.15
Specimen Thickness : 1.6mm

DS-7209(G)
DS-7209(HC)

CEM-1

CEM-1 is CCL that combines the superior performance of the glass epoxy laminate and the price competitiveness of the paper-phenol laminate.

DS-7106

Features

  • Excellent punchabilily
  • Significant reduction in dusting
  • Long punching tool life
  • Low warpage at high temperature

Applications

  • Automotive radio, television, smoke alarm, power supply, keyboard, clock, etc.

General Properties

Test ItemUnitTest ConditionProperty Data
Standard Value
Flammability - UL-94 V-0
Insulation Resistance ohm C-96/20/65
C-96/20/65+D-2/100		 1 x 1012 - 1 x 1013
1 x 1010 – 1 x 1011
Volume Resistivity ohm-cm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1014 - 1 x 1015
5 x 1013 – 5 x 1014
Surface Resistance ohm C-96/20/65
C-96/20/65+C-96/40/90		 5 x 1012 - 5 x 1014
1 x 1012 – 1 x 1013
Arc Resistance min. sec   100
Dielectric Constant(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 4.0 – 4.5
4.2 – 4.8
Dissipation Factor(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 0.015 – 0.020
0.018 - 0.023
Comparative Tracking Index volt ICE Method 200
Solder Float(260℃) sec A above 60
Peel Strength Cu.foil 1oz(0.035mm) kg/cm A 1.6 – 2.2
Flexural Strength kgf/mm2 A 30 - 35
Water Absorption % E-24/50+D-24/23 0.23 - 0.28
Punching Temperature ℃ A Ambient
Specimen Thickness : 1.6mm

DS-7106A

Features

  • Excellent punchabilily
  • Significant reduction in dusting
  • Long punching tool life
  • Low warpage at high temperature

Applications

  • Automotive radio, television, smoke alarm, power supply, keyboard, clock, etc.

General Properties

Test ItemUnitTest ConditionProperty Data
Standard Value
Flammability - UL-94 V-0
Insulation Resistance ohm C-96/20/65
C-96/20/65+D-2/100		 1 x 1012 - 1 x 1013
1 x 1010 – 1 x 1011
Volume Resistivity ohm-cm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1014 - 1 x 1015
5 x 1013 – 5 x 1014
Surface Resistance ohm C-96/20/65
C-96/20/65+C-96/40/90		 5 x 1012 - 5 x 1014
1 x 1012 – 1 x 1013
Arc Resistance min. sec   100
Dielectric Constant(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 4.0 – 4.5
4.2 – 4.8
Dissipation Factor(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 0.015 – 0.020
0.018 - 0.023
Comparative Tracking Index volt ICE Method 600
Solder Float(260℃) sec A above 40
Peel Strength Cu.foil 1oz(0.035mm) kg/cm A 1.5 – 1.8
Flexural Strength kgf/mm2 A 30 – 35
Water Absorption % E-24/50+D-24/23 0.23 – 0.28
Punching Temperature ℃ A Ambient
Specimen Thickness : 1.6mm

DS-7106A(G)

Features

  • Halogen-free, antimony-free, no toxic evolution during waste burning
  • High C.T.I. value(above 600V)
  • Excellent punchabilily
  • Low warpage at high temperature

Applications

  • Automotive radio, television, smoke alarm, power supply, keyboard, clock, etc.

General Properties

Test ItemUnitTest ConditionProperty Data
Standard Value
Flammability - UL-94 V-0
Insulation Resistance ohm C-96/20/65
C-96/20/65+D-2/100		 1 x 1012 - 1 x 1013
1 x 1010 – 1 x 1011
Volume Resistivity ohm-cm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1014 - 1 x 1015
5 x 1013 – 5 x 1014
Surface Resistance ohm C-96/20/65
C-96/20/65+C-96/40/90		 5 x 1012 - 5 x 1014
1 x 1012 – 1 x 1013
Arc Resistance min. sec   100
Dielectric Constant(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 4.0 – 4.5
4.2 – 4.8
Dissipation Factor(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 0.015 – 0.020
0.018 - 0.023
Comparative Tracking Index volt ICE Method 600
Solder Float(260℃) sec A above 40
Peel Strength Cu.foil 1oz(0.035mm) kg/cm A 1.5 – 1.8
Flexural Strength kgf/mm2 A 30 – 35
Water Absorption % E-24/50+D-24/23 0.23 – 0.28
Punching Temperature ℃ A Ambient
Specimen Thickness : 1.6mm

DS-7106A(HC)

FR-2

FR-2 is a paper-phenolic CCL that has a more enhanced moisture resistance and better electric insulation than the FR-1 that is used widely in home electronics.

DS-1202

Features

  • High C.T.I. value(over 600V)
  • Excellent heat and humidity resistance
  • Excellent dimensional stability
  • Good for automatic and surface mounting
  • Excellent punching processability

Applications

  • Automatic vending machine, heaters, color TV, microwave oven, measuring equipment, etc.

General Properties

Test ItemUnitTreatment ConditionProperty Data
Standard Value
Flammability - UL-94 avg : 3.0 max : 8.0
Insulation Resistance ohm C-96/20/65
C-96/20/65+D-2/100		 5 x 1011 - 5 x 1012
3 x 108 – 1 x 109
Volume Resistivity ohm-cm C-96/20/65
C-96/20/65+C-96/40/90		 5 x 1013 - 5 x 1014
5 x 1012 – 5 x 1013
Surface
Resistance		 Adhesive
Surface		 ohm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1012 - 1 x 1013
3 x 1011 – 7 x 1011
Laminate
Surface		 ohm C-96/20/65
C-96/20/65+C-96/40/90		 5 x 1011 - 5 x 1012
1 x 1010 – 5 x 1010
Dielectric Constant(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 4.3 – 48
4.5 – 5.0
Dissipation Factor(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 0.020 – 0.030
0.022 - 0.032
Comparative Tracking Index volt ICE Method 600
Solder Float(260℃) sec A 35 - 45
Peel
Strength		 Cu.foil 1oz
(0.035mm)		 kg f/cm A
S		 1.8 – 2.3
1.8 – 2.3
Flexural Strength(LW)(CW) kgf/mm2 A 15 – 18
14 - 17
Water Absorption % E-24/50+D-24/23 0.6 – 0.7
Trichloroethylene Resistance - Immersion in boiIing
Trichloroethylene
(For 2 minutes)		 No abnormality
Punching Process ability   A Suitable Temperature
50℃ - 70℃
Specimen Thickness : 1.6mm

DS-1202G

Features

  • Halogen-free, eliminating all kinds of brominated flame retardants
  • Absence of highly toxic dioxins in burning exhaust gas
  • Antimony-free, no toxic evolution during waste burning
  • Less odor, no cresol and its derivatives used

Applications

  • Automatic vending machine, heaters, color TV, microwave oven, measuring equipment, etc.

General Properties

Test ItemUnitTreatment ConditionProperty Data
Standard Value
Flammability - UL-94 avg : 3.0 max : 8.0
Insulation Resistance ohm C-96/20/65
C-96/20/65+D-2/100		 5 x 1011 - 5 x 1012
1 x 108 – 5 x 109
Volume Resistivity ohm-cm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1013 - 1 x 1014
5 x 1012 – 5 x 1013
Surface
Resistance		 Adhesive
Surface		 ohm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1012 - 1 x 1013
3 x 1011 – 7 x 1011
Laminate
Surface		 ohm C-96/20/65
C-96/20/65+C-96/40/90		 5 x 1011 - 5 x 1012
1 x 1010 – 5 x 1010
Dielectric Constant(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 4.3 – 48
4.5 – 5.0
Dissipation Factor(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 0.020 – 0.030
0.025 - 0.035
Comparative Tracking Index volt ICE Method 600
Solder Float(260℃) sec A 30 - 40
Peel
Strength		 Cu.foil 1oz
(0.035mm)		 kg/cm A
S		 1.8 – 2.3
1.8 – 2.3
Flexural Strength kgf/mm2 A 14 – 17
13 – 16
Water Absorption % E-24/50+D-24/23 0.6 – 0.7
Trichloroethylene Resistance - Immersion in boiIing
Trichloroethylene
(For 2 minutes)		 No abnormality
Punching Process ability   A Suitable Temperature
40℃ - 60℃
Specimen Thickness : 1.6mm

FR-1

A paper-phenolic CCL that has excellent PCB punching workability and that is used widely in home electronics.

DS-1107

Features

  • Excellent punchabilily
  • Flame retardant material
  • Minimum warpage and dimensional variation

Applications

  • Color TV, monitor, VCR, CDP , radio, component, stereo, etc.

General Properties

Test ItemUnitTreatment ConditionProperty Data
Standard Value
Flammability - UL-94 avg : 3.5 max : 8.0
Insulation Resistance ohm C-96/20/65
C-96/20/65+D-2/100		 5 x 1011 - 5 x 1012
5 x 107 – 5 x 108
Volume Resistivity ohm-cm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1013 - 1 x 1014
5 x 1012 – 5 x 1013
Surface
Resistance		 Adhesive
Surface		 ohm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1012 - 5 x 1012
1 x 1011 – 5 x 1011
Laminate
Surface		 ohm C-96/20/65
C-96/20/65+C-96/40/90		 5 x 1011 - 5 x 1012
1 x 109 – 5 x 1010
Dielectric Constant(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 4.3 – 5.0
5.5 – 5.5
Dissipation Factor(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 0.020 – 0.030
0.025 - 0.035
Solder Float(260℃) sec A 30 – 40
Peel
Strength		 Cu.foil 1oz
(0.035mm)		 kg/cm A
S		 1.8 – 2.3
1.8 – 2.3
Flexural Strength(LW)(CW) kgf/mm2 A 15 – 18
13 – 16
Water Absorption % E-24/50+D-24/23 0.8 – 1.0
Trichloroethylene Resistance - Immersion in boiIing
Trichloroethylene
(For 2 minutes)		 No abnormality
Punching Process ability   A Suitable Temperature
50℃ - 70℃
Specimen Thickness : 1.6mm

DS-1107A

Features

  • High CTI value(over 600V)
  • Excellent heat and humidity resistance
  • Good dimensional stability
  • Excellent punching process ability
  • Recommendable for high density circuits

Applications

  • Color TV, monitor, VCR, CDP , Radio, Component, stereo, etc.

General Properties

Test ItemUnitTreatment ConditionProperty Data
Standard Value
Flammability - UL-94 avg : 3.0 max : 8.0
Insulation Resistance ohm C-96/20/65
C-96/20/65+D-2/100		 5 x 1011 - 5 x 1012
3 x 108 – 8 x 108
Volume Resistivity ohm-cm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1013 - 1 x 1014
5 x 1012 – 5 x 1013
Surface
Resistance		 Adhesive
Surface		 ohm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1012 - 5 x 1012
1 x 1011 – 5 x 1011
Laminate
Surface		 ohm C-96/20/65
C-96/20/65+C-96/40/90		 5 x 1011 - 5 x 1012
5 x 109 – 1 x 1010
Dielectric Constant(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 4.0 – 5.0
4.5 – 5.5
Dissipation Factor(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 0.020 – 0.030
0.025 - 0.035
Comparative Tracking Index volt IEC Method 600
Solder Float(260℃) sec A 35 – 45
Peel
Strength		 Cu.foil 1oz
(0.035mm)		 kg/cm A
S		 1.8 – 2.3
1.8 – 2.3
Flexural Strength(LW)(CW) kgf/mm2 A 15 – 18
13 – 16
Water Absorption % E-24/50+D-24/23 0.7 – 0.9
Trichloroethylene Resistance - Immersion in boiIing
Trichloroethylene
(For 2 minutes)		 No abnormality
Punching Process ability   A Suitable Temperature
50℃ - 70℃
Specimen Thickness : 1.6mm

DS-1107(S)

Features

  • Anti-sliver migration
  • Superior for electrical property under moisture condition
  • High thermal resistance
  • Flame retardant material
  • Suitable to double sided application by silver through hole

Applications

  • Cordless phone, rom-drive, super VCR, CTV, CDP, car electronics, power supply, etc.

General Properties

Test ItemUnitTreatment ConditionProperty Data
Standard Value
Flammability - UL-94 avg : 3.0 max : 8.0
Insulation Resistance ohm C-96/20/65
C-96/20/65+D-2/100		 1 x 1012 - 1 x 1013
5 x 1010 – 5 x 1011
Volume Resistivity ohm-cm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1013 - 1 x 1014
1 x 1013 – 1 x 1014
Surface
Resistance		 Adhesive
Surface		 ohm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1012 - 1 x 1013
5 x 1010 – 5 x 1011
Laminate
Surface		 ohm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1012 - 1 x 1013
5 x 1010 – 5 x 1011
Dielectric Constant(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 4.0 – 5.0
4.2 – 5.2
Dissipation Factor(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 0.020 – 0.030
0.022 - 0.032
Solder Float(260℃) sec A 40 – 50
Peel Strength Cu.foil 1oz
(0.035mm)		 kg/cm A
S		 1.8 – 2.2
1.8 – 2.2
Flexural Strength(CW)(LW) kgf/mm2 A 15 – 18
14 – 17
Water Absorption % E-24/50+D-24/23 0.5 – 0.7
Trichloroethylene Resistance - Immersion in boiIing
Trichloroethylene
(For 2 minutes)		 No abnormality
Punching Process ability   A Suitable Temperature
70℃ - 90℃
Specimen Thickness : 1.6mm
DS-1108

Features

  • High CTI value(above 600V)
  • Halogen-free & elimination of all kinds of brominated flame retardants
  • Absence of highly toxic dioxins in burning exhausting gas
  • Antimony-free, no toxic evolution during waste burning
  • Less odor & no usage of cresol and its derivatives

Applications

  • Color TV, monitor, VCR, CDP, radio, component stereo, etc.

General Properties

Test ItemUnitTreatment ConditionProperty Data
Standard Value
Flammability - UL-94 avg : 3.0 max : 8.0
Insulation Resistance ohm C-96/20/65
C-96/20/65+D-2/100		 5 x 1011 - 1 x 1012
1 x 108 – 5 x 108
Volume Resistivity ohm-cm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1013 - 1 x 1014
5 x 1012 – 5 x 1013
Surface
Resistance		 Adhesive
Surface		 ohm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1012 - 5 x 1012
1 x 1011 – 5 x 1011
Laminate
Surface		 ohm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1011 - 1 x 1012
5 x 109 – 1 x 1010
Dielectric Constant(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 4.0 – 5.0
4.5 – 5.5
Dissipation Factor(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 0.020 – 0.030
0.025 - 0.035
Comparative Tracking Index volt ICE Method 600
Solder Float(260℃) sec A 30 – 40
Peel Strength Cu.foil 1oz
(0.035mm)		 kg/cm A
S		 1.8 – 2.3
1.8 – 2.3
Flexural Strength(LW)(CW) kgf/mm2 A 15 – 18
13 – 16
Water Absorption % E-24/50+D-24/23 0.8 – 1.0
Trichloroethylene Resistance - Immersion in boiIing
Trichloroethylene
(For 2 minutes)		 No abnormality
Punching Process ability   A Suitable Temperature
40℃ - 60℃
Specimen Thickness : 1.6mm
DS-1108(S)

Features

  • Halogen-free & elimination of all kinds of brominated flame retardants
  • Anti-silver migration
  • Superior electrical property under moisture condition
  • High thermal resistance
  • Flame retardant material
  • Suitable to double side application by silver through hole

Applications

  • Cordless phone, rom-drive, super VCR, CTV, CDP, car electronics, power supply, etc.

General Properties

Test ItemUnitTreatment ConditionProperty Data
Standard Value
Flammability - UL-94 avg : 3.0 max : 8.0
Insulation Resistance ohm C-96/20/65
C-96/20/65+D-2/100		 5 x 1012 - 5 x 1013
3 x 1010 – 8 x 1011
Volume Resistivity ohm-cm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1013 - 1 x 1014
1 x 1013 – 1 x 1014
Surface
Resistance		 Adhesive
Surface		 ohm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1012 - 1 x 1013
1 x 1011 – 5 x 1011
Laminate
Surface		 ohm C-96/20/65
C-96/20/65+C-96/40/90		 1 x 1012 - 1 x 1013
5 x 1010 – 5 x 1011
Dielectric Constant(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 4.0 – 5.0
4.2 – 5.2
Dissipation Factor(1MHz) - C-96/20/65
C-96/20/65+D-48/50		 0.020 – 0.030
0.022 - 0.032
Solder Float(260℃) sec A 40 – 50
Peel Strength Cu.foil 1oz
(0.035mm)		 kg/cm A
S		 1.8 – 2.2
1.8 – 2.2
Flexural Strength(LW)(CW) kgf/mm2 A 15 – 18
14 – 17
Water Absorption % E-24/50+D-24/23 0.5 – 0.7
Trichloroethylene Resistance - Immersion in boiIing
Trichloroethylene
(For 2 minutes)		 No abnormality
Punching Process ability   A Suitable Temperature
70℃ - 90℃
Specimen Thickness : 1.6mm

Resin Coated Copper

' More Functions in Smaller Size.' Resin Coated Copper is optimized for the HDI(High Density Interconnect) method which is essential for mobile application products.

DSF-400 / DSF-400G / DSF-500

Insulating material coated with partially cured resin onto the copper foil, can be used as a cap layer of MLB

DSF-400 / DSF-400G / DSF-500

Features

  • Glass-free
  • Good laser processibility
  • Low Dk. high operating speed
  • Compatible with conventional lamination process
  • Easier to produce finder line and space

Applications

  • Microvia formation for high density board
  • Packaging solution for thinner, lighter product

General Properties

Test Item Unit Condition DSF-400 DSF-400G DSF-
500
Flame Class - A UL 94V-0 UL 94V-0 UL 94V-0
Tg(DMA) ℃ - 145 145 185
Insulation Resistance ohmn C-96/20/65 5x1013
~5x1014		 5x1013
~5x1014		 5x1013
~5x1014
C-96/20/65
+ D-3/100		 5x1012
~5x1013		 5x1012
~5x1013		 5x1012
~5x1013
Volume Resistivity ohmn-cm C-96/20/65 1x1014
~1x1015		 1x1014
~1x1015		 1x1014
~1x1015
C-96/20/65
+ C-96/50/90		 5x1013
~5x1014		 5x1013
~5x1014		 5x1013
~5x1014
Surface Resistance ohmn C-96/20/65 1x1013
~1x1014		 1x1013
~1x1014		 1x1013
~1x1014
C-96/20/65
+ C-96/50/90		 5x1013
~5x1013		 5x1013
~5x1013		 5x1013
~5x1013
Dielectric Constant(1GHz)   C-96/20/65 3.35 3.30 3.40
Dissipation Factor(1GHz)   C-96/20/65 0.025 0.025 0.025
Solder Float   288℃, 60 sec good good good
288℃, 60 sec good good good
Peel Strength(H oz) kgf/cm A 1.4~1.6 1.2~1.4 1.4~1.6
After Solder
(260℃, 20 sec)		 1.4~1.6 1.2~1.4 1.4~1.6
Specific Gracity   - 1.3~1.4 1.3~1.4 1.3~1.4